Handbook of Digital Techniques for High-Speed Design 英文原版 高清PDF电子书

Handbook of Digital Techniques for High-Speed Design: Design Examples, Signaling and Memory Technologies, Fiber Optics, Modeling, and Simulation to Ensure Signal Integrity 英文原版 PDF 电子书，Tom Granberg 著，高速数字设计深入学习必读的一本书，目前国内亚马逊上售价 1156RMB。

此书作为信号完整性学习的进一步阅读教材，涵盖了高速板级数字设计的各个方面，对 PCB 上常见的高速互联总线、高速背板等的信号完整性问题做了详细的讲解，详细描述了高速传输线和寄生效应，电缆，连接器，单端/差分端接技术，进行信号完整性相关测试的仪器设备，还包括了各类高速 RAM 的规范做了详细的讲解。

Handbook of Digital Techniques for High-Speed Design 图书目录

I. INTRODUCTION.
1. Trends in High-Speed Design.
2. ASICs, Backplane Configurations, and SerDes Technology.
3. A Few Basics on Signal Integrity.

II. SIGNALING TECHNOLOGIES AND DEVICES.
4. Gunning Transceiver Logic (GTL, GTLP, GTL+, AGTL+).
5. Low Voltage Differential Signaling (LVDS).
6. Bus LVDS (BLVDS), LVDS Multipoint (LVDM), and Multipoint LVDS (M-LVDS).
7. High-Speed Transceiver Logic (HSTL) and Stub-Series Terminated Logic (SSTL).
8. Emitter Coupled Logic (ECL, PECL, LVPECL, ECLinPS Lite and Plus, SiGe, ECL Pro, GigaPro and GigaComm).
9. Current-Mode Logic (CML).
10. FPGAs – 3.125 Gbps RocketIOs and HardCopy Devices.
11. Fiber-Optic Components.
12. High-Speed Interconnects and Cabling.

III. HIGH-SPEED MEMORY AND MEMORY INTERFACES.
13. Memory Device Overview and Memory Signaling Technologies.
14. Double Data Rate SDRAM (DDR, DDR2) and SPICE Simulation.
15. GDDR3, ZBT, FCRAM, SigmaRAM, RLDRAM, DDR SRAM, Flash, FeRAM, and MRAM.
16. Quad Data Rate (QDR, QDRII) SRAM.
17. Direct Rambus DRAM (DRDRAM).
18. Xtreme Data Rate (XDR) DRAM, FlexPhase and ODR.

IV. MODELING, SIMULATION, AND EDA TOOLS.
19. Differential and Mixed-Mode S Parameters.
20. Time Domain Reflectometry (TDR), Time Domain Transmission (TDT), and VNAs.
21. Modeling with IBIS.
22. Mentor Graphics – EDA Tools for High-Speed Design, Simulation, Verification, and Layout.

V. DESIGN CONCEPTS AND EXAMPLES.
23. Advances in Design, Modeling, Simulation, and Measurement Validation of High-Performance Board-to-Board 5-to-10 Gbps Interconnects.
Appendix 23A. Generalized N-Port, Mixed-Mode S-Parameters.
24. IBIS Modeling and Simulation of High-Speed Fiber-Optic Transceivers.
25. Designing with LVDS.
26. Designing to 10 Gbps Using SerDes Transceivers, Serializers, and Deserializers.
27. WarpLink SerDes System Design Example.

VI. EMERGING PROTOCOLS AND TECHNOLOGIES.
28. Electrical Optical Circuit Board (EOCB).
29. RapidIO.
30. PCI Express and ExpressCard.

VII. LAB AND TEST INSTRUMENTATION.
31. Electrical and Optical Test Equipment.

Acronyms.
References.
About the Author.

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